发明名称 |
METAL NANOPARTICLE DISPERSION, PROCESS FOR PRODUCING METAL NANOPARTICLE DISPERSION, AND BONDING METHOD |
摘要 |
Provided is a metal nanoparticle dispersion which renders low-temperature (e.g., 200°C or lower) bonding possible and which can make the bonded part have satisfactory mechanical properties and electrical properties. The metal nanoparticle dispersion comprises metal nanoparticles in which at least some of the surface has been coated with a C8 or higher amine (A) and a dispersion medium for dispersing the metal nanoparticles, wherein the dispersion medium contains an amine (B) which is a primary, secondary, or tertiary, C7 or lower amine and is a linear alkylamine or alkanolamine. |
申请公布号 |
WO2014175417(A1) |
申请公布日期 |
2014.10.30 |
申请号 |
WO2014JP61678 |
申请日期 |
2014.04.25 |
申请人 |
DOWA ELECTRONICS MATERIALS CO., LTD. |
发明人 |
ENDOH KEIICHI;MIYOSHI HIROMASA;HINOTSU TAKASHI;KURITA SATORU;KOHNO YOSHIKO |
分类号 |
B22F9/00;B22F1/02;B22F9/24;H01B1/00;H01B1/22;H01B13/00;H01R43/00 |
主分类号 |
B22F9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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