发明名称 |
SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES |
摘要 |
Semiconductor packages and methods for forming a semiconductor package are disclosed. The method includes providing a package substrate having first and second major surfaces. The package substrate includes a base substrate having a mold material and a plurality of interconnect structures including via contacts extending through the first to the second major surface of the package substrate. A die having conductive contacts on its first or second surface is provided. The conductive contacts of the die are electrically coupled to the interconnect structures. A cap is formed over the package substrate to encapsulate the die. |
申请公布号 |
SG10201400559P(A) |
申请公布日期 |
2014.10.30 |
申请号 |
SG10201400559P |
申请日期 |
2014.03.11 |
申请人 |
UNITED TEST AND ASSEMBLY CENTER LTD |
发明人 |
YONGBO YANG;ANTONIO JR. BAMBALAN DIMAANO;CHUN HONG WO |
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