| 摘要 |
<p>PROBLEM TO BE SOLVED: To achieve downsizing by improvement of wiring efficiency and cost reduction by simpler processes.SOLUTION: The multilayer wiring board includes: a double-sided wiring board where a conformal veer which has a first wiring layer and a second wiring layer connected to an inner surface of a concavity, opens on the first wiring layer side and has a prescribed land around the opening is formed; a second insulator layer laminated on the first wiring layer side of the double-sided wiring board via a first adhesion layer; a single-sided wiring board having a third insulator layer laminated on the second insulator layer via a second adhesion layer and a second wiring layer formed on a surface of the third insulator layer opposite to the double-sided wiring board; a first conductive paste veer which is disposed directly above the conformal veer, penetrates the third insulator layer of the single-sided wiring board and has one end connected to the second wiring layer and the other end reaching the second insulator layer; and a second conductive paste veer which is thinner than the first conductive paste veer and has one end connected to a peripheral part of the first conductive paste veer and the other end connected to the land of the conformal veer after penetrating the second insulator layer.</p> |
