发明名称 IMAGING APPARATUS, MANUFACTURING METHOD OF IMAGING APPARATUS, AND JUNCTION STRENGTH TEST METHOD OF IMAGING APPARATUS
摘要 <p>PROBLEM TO BE SOLVED: To provide an imaging apparatus 1A which facilitates a strength test of a junction.SOLUTION: The imaging apparatus 1A comprises: a wiring board 20 including a plurality of flying leads 23 respectively extending from a plurality of inner leads 21 disposed in a base film 22; and an imaging chip 10 in which a plurality of junction terminals 12 joined with distal end portions of the flying leads 23 are provided in a columnar shape on a streight line parallel with a terminal side. A junction of a flying lead 23D protruding from a notch 24 formed on the terminal side of the base film 22 and longer than the other flying leads and a junction terminal 12D is fractured.</p>
申请公布号 JP2014207371(A) 申请公布日期 2014.10.30
申请号 JP20130084919 申请日期 2013.04.15
申请人 OLYMPUS CORP 发明人 NISHIMURA YOSHIRO
分类号 H01L27/14 主分类号 H01L27/14
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