发明名称 ELECTRONIC DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To solve the problem that, it is necessary to prevent a communication hole formed in a casing from being closed by a resin leaked to a lower side of a circuit board when the resin flows into the casing and, in particular, in the case where the communication hole is formed on a bottom of the casing, when the resin leaked to the lower side of the circuit board is spread along an inner bottom face of the casing, the communication hole is in danger of being closed with the resin.SOLUTION: On an inner bottom face of a casing, a flow stopper for preventing a resin from flowing towards a communication hole along the inner bottom face is formed while surrounding the communication hole.</p>
申请公布号 JP2014207345(A) 申请公布日期 2014.10.30
申请号 JP20130084556 申请日期 2013.04.15
申请人 RINNAI CORP;RB CONTROLS CO 发明人 SHIBUYA YASUAKI;ARAKAWA RYOHEI
分类号 H01L21/56;H01L23/28 主分类号 H01L21/56
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