METHOD FOR MANUFACTURING CONNECTION STRUCTURE AND CONNECTION STRUCTURE

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a connection structure capable of suppressing warpage of a connection object member and improving connection reliability and inter-electrode conduction reliability of the connection object member.SOLUTION: A method for manufacturing a connection structure 1 forms a connection 4 connecting a first connection object member 2 and a second connection object member 3 by a conductive material containing a conductive particle 21 and a binder resin 11 by hardening the binder resin 11 using the conductive material. A first electrode 2a and a second electrode 3a are electrically connected by the conductive particle 21. The conductive particle 21 includes a plurality of protrusions on a conductive surface. An average height of the protrusions is not less than 50 nm and not more than 500 nm. The number of protrusions is not less than 3 and not more than 30 per 1μmof a surface area of the conductive particle 21. The connection 4 includes a first region R1 whose hardening rate is not less than 80% and not more than 90% and a second region R2 whose hardening rate exceeds 90%.