发明名称 ELECTROCONDUCTIVE PASTE, THIN ELECTROCONDUCTIVE FILM, AND CIRCUIT
摘要 <p>PROBLEM TO BE SOLVED: To provide an electroconductive paste capable of inducing the manifestation of electroconductivity via a firing method predicated on a superheated steam treatment, of lowering the temperature at which the electroconductivity manifests, and of being extensively applied even to substrates devoid of heat resistance.SOLUTION: The provided electroconductive paste is an electroconductive paste including an electroconductive metal powder, a resin binder, and a solvent wherein the decomposition commencement temperature of the resin binder is 300°C or below and wherein the electroconductivity of the electroconductive paste manifests via a superheated steam treatment following the printing or coating thereof.</p>
申请公布号 JP2014207166(A) 申请公布日期 2014.10.30
申请号 JP20130084736 申请日期 2013.04.15
申请人 TOYOBO CO LTD 发明人 OGI KOJI
分类号 H01B1/22;C08L67/00;C08L101/00;C09D5/24;C09D7/12;C09D201/00;H01B5/14;H05K3/12 主分类号 H01B1/22
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