APPARATUS AND METHOD FOR ALIGNING AND CENTERING WAFERS

摘要

A device for locating and engaging a notch on the perimeter of a circular wafer includes a notch locating component and a first plate. The notch locating component is configured to move linearly along a first axis and includes a front elongated component extending along a second axis perpendicular to the first axis and having a front surface, a back surface opposite to the front surface and a first protrusion extending from the front surface of the elongated component. The first protrusion has a shape complementing the shape of a notch formed on the perimeter of a circular wafer. As the notch locating component is driven toward the perimeter of the circular wafer along the first axis, a distance between the back surface of the elongated component and a front surface of the first plate is measured and the value of the measured distance is used to determine engagement of the first protrusion with the notch.

主权项

1. A device for locating and engaging a notch on the perimeter of a circular wafer comprising:
a notch locating component configured to move linearly along a first axis and comprising a front elongated component extending along a second axis perpendicular to the first axis and comprising a front surface, a back surface opposite to the front surface and a first protrusion extending from the front surface of the elongated component and wherein the first protrusion comprises a shape complementing the shape of a notch formed on the perimeter of a circular wafer; a first plate arranged at a first side of the front elongated component; wherein as the notch locating component is driven toward the perimeter of the circular wafer along the first axis, a distance between the back surface of the elongated component and a front surface of the first plate is measured and the value of the measured distance is used to determine engagement of the first protrusion with the notch.