| 发明名称 |
SEMICONDUCTOR CHIP AND A SEMICONDUCTOR PACKAGE HAVING A PACKAGE ON PACKAGE (POP) STRUCTURE INCLUDING THE SEMICONDUCTOR CHIP |
| 摘要 |
A semiconductor chip including a substrate, a first data pad arranged on the substrate, and a first control/address pad arranged on the substrate, wherein the first data pad is arranged in an edge region of the substrate, and the first control/address pad is arranged in a center region of the substrate. |
| 申请公布号 |
US2014319701(A1) |
申请公布日期 |
2014.10.30 |
| 申请号 |
US201314132516 |
申请日期 |
2013.12.18 |
| 申请人 |
Kim Yong-hoon;Kang Hyo-soon;Lee Hee-seok;Cho Jang-ho |
发明人 |
Kim Yong-hoon;Kang Hyo-soon;Lee Hee-seok;Cho Jang-ho |
| 分类号 |
H01L25/18;H01L23/50 |
主分类号 |
H01L25/18 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor chip, comprising:
a substrate; a first data pad arranged on the substrate; and a first control/address pad arranged on the substrate, wherein the first data pad is arranged in an edge region of the substrate, and the first control/address pad is arranged in a center region of the substrate. |
| 地址 |
Suwon-si KR |
