发明名称 MULTI-LAYER CERAMIC VACUUM TO ATMOSPHERE ELECTRIC FEED THROUGH
摘要 Embodiments of this invention use multi-layer ceramic substrate with one or more hermetically sealed and filled metal vias with smaller pitch and size in combination with flexible printed circuit cables and interposers to provide a custom electric feed through for vacuum to atmosphere chambers. This abstract is provided to comply with rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.
申请公布号 US2014318855(A1) 申请公布日期 2014.10.30
申请号 US201414256828 申请日期 2014.04.18
申请人 KLA-Tencor Corporation 发明人 Haynes Robert;Nasser-Ghodsi Mehran
分类号 H02G3/22;H05K3/40;H02G1/14 主分类号 H02G3/22
代理机构 代理人
主权项 1. An apparatus, comprising: a feedthrough, wherein the feedthrough includes a ceramic structure having a first surface and a second surface at opposing ends of the ceramic structure, wherein the feedthrough includes conductors embedded in the ceramic structure and extending from the first surface to the second surface of the ceramic structure to form corresponding arrays of conductive contacts at the first surface and the second surface, and wherein the conductors are flush with the first surface of the ceramic structure; and a cable electrically connected to the contacts at the first surface of the ceramic structure, wherein the cable has a contact array pattern that matches the array of conductive contacts on the first surface of the ceramic structure.
地址 Milpitas CA US