| 发明名称 |
CHIP-ON-FILM PACKAGE AND DISPLAY DEVICE HAVING THE SAME |
| 摘要 |
A chip-on-film package includes a base film, a test line, and an integrated circuit chip. The base film includes a bent area in which a bending occurs. The test line is disposed on the base film, and at least a portion of the test line is overlapped with the bent area. The integrated circuit chip is disposed on the base film and includes a first terminal and a second terminal. The first terminal is connected to one end of the test line to output a first signal and the second terminal is connected to the other end of the test line to receive a second signal. The integrated circuit chip detects whether a crack occurs in the bent area based on a difference value in signal characteristics. |
| 申请公布号 |
US2014319523(A1) |
申请公布日期 |
2014.10.30 |
| 申请号 |
US201314062580 |
申请日期 |
2013.10.24 |
| 申请人 |
Samsung Display Co., Ltd. |
发明人 |
LEE Hee Kwon |
| 分类号 |
H01L21/66;H01L23/488 |
主分类号 |
H01L21/66 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A chip-on-film package, comprising:
a base film including a bent area in which a bending occurs; a test line disposed on the base film, at least a portion of the test line overlapping the bent area; and an integrated circuit chip disposed on the base film and including a first terminal connected to one end of the test line to output a first signal and a second terminal connected to the other end of the test line to receive a second signal, the integrated circuit chip determining whether a crack has occurred in the bent area based on a difference value in signal characteristics between the first signal and the second signal. |
| 地址 |
Yongin-City KR |
