发明名称 THERMAL MODULE
摘要 A thermal module includes a first heat transfer member and a second heat transfer member. The first heat transfer member has a first chamber in which a first capillary structure is disposed. The second heat transfer member has a second chamber and a conduction section. A second capillary structure is disposed in the second chamber. The conduction section is received in the first chamber. A third capillary structure is disposed on outer surface of the conduction section. A working fluid is respectively filled in the first and second chambers. The third capillary structure is disposed on the outer surface of the conduction section to enhance the heat transfer effect of the second heat transfer member so as to enhance the heat transfer efficiency of the entire thermal module.
申请公布号 US2014318745(A1) 申请公布日期 2014.10.30
申请号 US201414250358 申请日期 2014.04.10
申请人 ASIA VITAL COMPONENTS CO., LTD. 发明人 Yang Hsiu-Wei
分类号 F28D15/04 主分类号 F28D15/04
代理机构 代理人
主权项 1. A thermal module comprising: a first heat transfer member having a first chamber in which a first capillary structure is disposed; and a second heat transfer member having a second chamber and a conduction section, a second capillary structure being disposed in the second chamber, the conduction section being received in the first chamber, a third capillary structure being disposed on outer surface of the conduction section, a working fluid being respectively filled in the first and second chambers.
地址 New Taipei City TW
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