BONDING APPARATUS, BONDING SYSTEM AND BONDING METHOD

摘要

A bonding apparatus according to an exemplary embodiment of the present disclosure includes a first holding unit, a second holding unit, a first cooling mechanism, a second cooling mechanism, a third heating mechanism and a fourth heating mechanism. The first holding unit has a first heating mechanism and holds a first substrate. The second holding unit has a second heating mechanism and holds a second substrate. The pressing mechanism contacts and presses the first substrate and the second substrate. The first cooling mechanism cools the first substrate through the first holding unit. The second cooling mechanism cools the second substrate through the second holding unit. The third heating mechanism heats the first cooling mechanism. The fourth heating mechanism heats the second cooling mechanism.

主权项

1. A bonding apparatus comprising:
a first holding unit provided with a first heating mechanism and configured to hold a first substrate; a second holding unit disposed facing the first holding unit, provided with a second heating mechanism and configured to hold a second substrate; a pressing mechanism configured to relatively move the first holding unit and the second holding unit in order to contact and press the first substrate and the second substrate; a first cooling mechanism provided at an opposite side to a holding surface of the first holding unit and configured to cool the first substrate through the first holding unit; a second cooling mechanism provided at an opposite side to a holding surface of the second holding unit and configured to cool the second substrate through the second holding unit; a third heating mechanism provided on a surface of the first cooling mechanism opposite to the surface on which the first holding unit is disposed and configured to heat the first cooling mechanism; and a fourth heating mechanism provided on a surface of the second cooling mechanism opposite to the surface on which the second holding unit is disposed and configured to heat the second cooling mechanism.