SUBMOUNT FOR ELECTRONIC, OPTOELECTRONIC, OPTICAL, OR PHOTONIC COMPONENTS

摘要

One or more metal contacts are formed in a recessed area on a top surface of a submount; a pickup tool of a die bonder engages protruding peripheral regions of the submount so as not to damage the metal contacts or metal bumps in the recessed region. A semiconductor optical submount includes non-contiguous dielectric layers between metal contacts and the semiconductor material to reduce parasitic capacitance.

主权项

1. An apparatus comprising a submount formed from a volume of solid submount material wherein:
(a) a top surface of the submount includes one or more metal contacts formed on corresponding contact areas that are arranged for attaching a component to the top surface of the submount; (b) the one or more contact areas are positioned on a region of the submount top surface that is (i) recessed relative to one or more protruding regions of the submount top surface and (ii) sized and shaped to accommodate the attached component positioned at least partly within the recessed region; and (c) one or more of the protruding regions form a surface for engaging a pickup tool of a die bonder and enabling the die bonder to attach the submount to a substrate without substantial contact between the pickup tool and the recessed region.