| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition and a resin film, which can integrally mold a wafer (to obtain a wafer mold), particularly shows good molding property for a wafer having a large diameter or a thin film wafer, as well as gives low warpage and good wafer protecting performance after molding, facilitates a molding process in good conditions and can be suitably used for a wafer level package.SOLUTION: The resin composition comprises the following components (A), (B) and (C): (A) a silicone resin expressed by general formula (1) shown below and having a weight average molecular weight of 3000 to 500000; (B) a thermosetting resin; and (C) a filler. |
