METHOD AND APPARATUS FOR TRANSFERRING DATA BETWEEN A HOST AND BOTH A SOLID-STATE MEMORY AND A MAGNETIC STORAGE DEVICE

摘要

A hybrid circuit includes a system-in-a-package (SIP) and an integrated circuit. The SIP includes a solid-state memory, and a first control module. The first control module controls access to the solid-state memory based on a first control signal. The integrated circuit includes an embedded multi-media card (eMMC) module, a second control module, and a management module. The eMMC module is in communication with the SIP according to an eMMC standard. The first eMMC module transfers the first control signal to the first control module to access the solid-state memory. The second control module controls access to a magnetic storage device based on a second control signal. The management module generates the control signals to transfer first data between a host and the SIP via the eMMC module and transfer the first data or second data between the host and the magnetic storage device via the second control module.

主权项

1. A hybrid circuit comprising:
a system-in-a-package comprising
a first solid-state memory, anda first control module configured to control access to the first solid-state memory based on a first control signal; and a first integrated circuit comprising
a first embedded multi-media card module in communication with the system-in-a-package according to an embedded multi-media card standard, wherein the first embedded multi-media card module is configured to transfer the first control signal to the first control module to access the first solid-state memory,a second control module configured to control access to a magnetic storage device based on a second control signal, anda management module configured to (i) generate the first control signal to transfer first data between a host and the system-in-a-package via the first embedded multi-media card module, and (ii) generate the second control signal to transfer the first data or second data between the host and the magnetic storage device via the second control module, wherein the host is separate from the first integrated circuit and the system-in-a package.