发明名称 RESIN MULTILAYER SUBSTRATE
摘要 A resin multilayer substrate includes a resin structure formed by laminating a plurality of resin layers and disposed components. Built-in components are embedded within the resin structure and a mounted component mounted on a surface of the resin structure. The resin structure includes a flexible part in which a first lamination number of the resin layers are laminated and a rigid part in which a second lamination number of the resin layers is laminated. The second lamination number is larger than the first lamination number. When viewed in a plan view, the flexible part has a shape which is not a rectangle, and a disposed component which is closest to a boundary line between the flexible part and the rigid part is disposed such that a side thereof which is closest to the boundary line is parallel to the boundary line.
申请公布号 US2014321076(A1) 申请公布日期 2014.10.30
申请号 US201414330110 申请日期 2014.07.14
申请人 Murata Manufacturing Co., Ltd. 发明人 Sakai Norio;Otsubo Yoshihito
分类号 H05K1/02;H05K1/18 主分类号 H05K1/02
代理机构 代理人
主权项 1. A resin multilayer substrate, comprising: a resin structure comprising a plurality of laminated resin layers; and one or more disposed components comprising each one of built-in components embedded within said resin structure and mounted components mounted on a surface of said resin structure, wherein said resin structure includes a flexible part in which a first lamination number of said resin layers are laminated, and a rigid part in which a second lamination number of said resin layers are laminated, said rigid part being less flexible than said flexible part, said second lamination number being larger than said first lamination number, and when viewed in a direction perpendicular to the surface of said resin structure, said flexible part has a shape which is not a rectangle, and, among said one or more disposed components, a disposed component which is closest to a boundary line between said flexible part and said rigid part is disposed such that a side of the disposed component which is closest to said boundary line is parallel to said boundary line.
地址 Kyoto JP