| 发明名称 |
POWER MODULE |
| 摘要 |
Provided is a power module. The power module includes a power semiconductor chip. The power module further includes a case that accommodates the power semiconductor chip. A silicone gel seals the power semiconductor chip within the case. The silicone gel including a heat-resistant silicone gel containing 20 to 100 mass ppm of a metal complex comprising a metal selected from a group consisting of iron and platinum. |
| 申请公布号 |
US2014319669(A1) |
申请公布日期 |
2014.10.30 |
| 申请号 |
US201414262076 |
申请日期 |
2014.04.25 |
| 申请人 |
FUJI ELECTRIC CO., LTD. |
发明人 |
KIMIJIMA Daisuke;ICHIMURA Yuji |
| 分类号 |
H01L23/42 |
主分类号 |
H01L23/42 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A power module comprising:
a power semiconductor chip; a case that accommodates the power semiconductor chip; and a heat-resistant silicone gel that seals the power semiconductor chip within the case, the heat-resistant silicone gel containing 20 to 100 mass ppm of a metal complex comprising a metal selected from a group consisting of iron and platinum. |
| 地址 |
Kawasaki-shi JP |
