| 发明名称 |
BONDING STRUCTURE OF DIAPHRAGM FOR MICROSPEAKER |
| 摘要 |
The present invention relates to an assembly structure of a diaphragm for a microspeaker. The present invention discloses a bonding structure of a diaphragm for a microspeaker, the boding structure comprising: a suspension including a central portion, an outer peripheral portion, and a connecting portion connecting the central portion and the outer peripheral portion; and a side diaphragm including an inner peripheral portion and an outer peripheral portion, which are attached to the central portion and outer peripheral portion of the suspension, respectively, and a dome portion, which projects between the inner peripheral portion and the outer peripheral portion, wherein the suspension and the side diaphragm are attached by thermal compression. |
| 申请公布号 |
US2014318885(A1) |
申请公布日期 |
2014.10.30 |
| 申请号 |
US201314031385 |
申请日期 |
2013.09.19 |
| 申请人 |
Em-Tech. Co., LTd. |
发明人 |
Kim Ji Hoon;Kwon Joong Hak;Lee Jung Hyung;Oh Hyeon Taek |
| 分类号 |
H04R7/02 |
主分类号 |
H04R7/02 |
| 代理机构 |
|
代理人 |
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| 主权项 |
1. A bonding structure of a diaphragm for a microspeaker, the bonding structure comprising:
a suspension including a central portion, an outer peripheral portion, and a connecting portion connecting the central portion and the outer peripheral portion; and a side diaphragm including an inner peripheral portion and an outer peripheral portion, which are attached to the central portion and outer peripheral portion of the suspension, respectively, and a dome portion, which projects between the inner peripheral portion and the outer peripheral portion, wherein the suspension and the side diaphragm are attached by thermal compression. |
| 地址 |
Busan KR |
