POWER ELECTRONICS ASSEMBLIES, INSULATED METAL SUBSTRATE ASSEMBLIES, AND VEHICLES INCORPORATING THE SAME

摘要

A power electronics assembly includes a semiconductor device, an insulated metal substrate, and a cooling structure. The insulated metal substrate includes a dielectric layer positioned between first and second metal layers, and a plurality of stress-relief through-features extending through the first metal layer, the second metal layer, the dielectric layer, or combinations thereof. The semiconductor device is thermally coupled to the first metal layer and the plurality of stress relief through-features is positioned around the semiconductor device. The cooling structure is bonded directly to the second metal layer of the insulated metal substrate. Insulated metal substrate assemblies are also disclosed. The insulated metal substrate includes a plurality of stress-relief through-features extending through a first metal layer, a second metal layer, and a dielectric layer. Vehicles having power electronics assemblies with stress-relief through-features are also disclosed.

主权项

1. A direct bonded insulated metal substrate assembly comprising:
a direct bonded insulated metal substrate comprising a dielectric layer positioned between and direct bonded to a first metal layer and a second metal layer, and a plurality of stress-relief through-features extending through the first metal layer, the second metal layer, and the dielectric layer; and a cooling structure bonded directly to the second metal layer of the direct bonded insulated metal substrate.