发明名称 SEMICONDUCTOR DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To easily ensure electrical insulation between a first circuit and a second circuit even when signal voltages of the first circuit and the second circuit are different from each other.SOLUTION: A semiconductor chip 10 has a first circuit 100 and a first inductor 302. The semiconductor chip 20 has a second circuit 200 and a chip side connection terminal 545. A wiring board 60 is attached to an area ranging from the semiconductor chip 10 to the semiconductor chip 20. The wiring board 60 has a second inductor 304 and a substrate side connection terminal 610. The second inductor 304 is positioned above the first inductor 302. The chip side connection terminal 545 and the two substrate side connection terminals 610 are connected with each other through first solder balls 700.</p>
申请公布号 JP2014207466(A) 申请公布日期 2014.10.30
申请号 JP20140119219 申请日期 2014.06.10
申请人 RENESAS ELECTRONICS CORP 发明人 NAKASHIBA YASUTAKA
分类号 H01L25/00;H01L21/3205;H01L21/768;H01L21/822;H01L23/12;H01L23/522;H01L23/538;H01L25/04;H01L25/18;H01L27/04 主分类号 H01L25/00
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