发明名称 |
HYBRID-INTEGRATED PHOTONIC CHIP PACKAGE WITH AN INTERPOSER |
摘要 |
A chip package includes an optical integrated circuit (such as a hybrid integrated circuit) and an integrated circuit that are proximate to each other in the chip package. The integrated circuit includes electrical circuits, such as memory or a processor, and the optical integrated circuit communicates optical signals with very high bandwidth. Moreover, a front surface of the integrated circuit is electrically coupled to a top surface of an interposer, and this top surface is in turn electrically coupled to a front surface of an input/output (I/O) integrated circuit that faces the top surface. Furthermore, the front surface of the I/O integrated circuit is electrically coupled to a top surface of the optical integrated circuit, where the top surface of the optical integrated circuit faces the front surface of the I/O integrated circuit. |
申请公布号 |
US2014321804(A1) |
申请公布日期 |
2014.10.30 |
申请号 |
US201314047978 |
申请日期 |
2013.10.07 |
申请人 |
Oracle International Corporation |
发明人 |
Thacker Hiren D.;Krishnamoorthy Ashok V.;Hopkins, II Robert David;Lexau Jon;Zheng Xuezhe;Ho Ronald;Shubin Ivan;Cunningham John E. |
分类号 |
G02B6/12 |
主分类号 |
G02B6/12 |
代理机构 |
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代理人 |
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主权项 |
1. A chip package, comprising:
an integrated circuit having a front surface with integrated-circuit connector pads; integrated-circuit electrical connectors electrically coupled to the integrated-circuit connector pads; an interposer having a top surface, facing the front surface of the integrated circuit, with first interposer connector pads, electrically coupled to the integrated-circuit electrical connectors, and second interposer connector pads; input/output (I/O)-integrated-circuit electrical connectors electrically coupled to the second interposer connector pads; an I/O integrated circuit having a front surface, facing the top surface, with first I/O-integrated-circuit connector pads electrically coupled to the I/O-integrated-circuit electrical connectors, and second I/O-integrated-circuit connector pads, wherein the I/O integrated circuit is proximate to the integrated circuit on a same side of the interposer, and wherein the I/O integrated circuit includes electrical I/O circuits and optical driver and receiver circuits; optical-integrated-circuit electrical connectors electrically coupled to the second I/O-integrated-circuit connector pads; and an optical integrated circuit having a top surface, facing the front surface of the I/O integrated circuit, with optical-integrated-circuit connector pads electrically coupled to the optical-integrated-circuit electrical connectors, wherein the optical integrated circuit is configured to communicate optical signals. |
地址 |
Redwood City CA US |