| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device that allows easily forming a water-repellent film for preventing a die-bonding material from reaching a top surface of a semiconductor chip, and to provide a method of manufacturing the semiconductor device.SOLUTION: A semiconductor device according to the present invention includes: a die pad 10; a die-bonding material 12 provided on the die pad; a semiconductor chip 14 fixed to the die pad by its lower surface being in contact with the die-bonding material; and a water-repellent film 24 formed only on side surfaces of the semiconductor chip. |
