| 发明名称 |
IRRADIATION APPARATUS FOR IRRADIATING CHARGED PARTICLE BEAM, METHOD FOR IRRADIATION OF CHARGED PARTICLE BEAM, AND METHOD FOR MANUFACTURING ARTICLE |
| 摘要 |
An apparatus includes an optical system configured to irradiate a substrate with a charged particle beam, a control unit configured to control an irradiation position of the charged particle beam, and a first measurement unit and a second measurement unit each configured to measure a surface position of the substrate. The first measurement unit and the second measurement unit have different characteristics in terms of charging. The control unit controls the irradiation position of the charged particle beam based on values measured by the first measurement unit and the second measurement unit. |
| 申请公布号 |
US2014322833(A1) |
申请公布日期 |
2014.10.30 |
| 申请号 |
US201414256779 |
申请日期 |
2014.04.18 |
| 申请人 |
Canon Kabushiki Kaisha |
发明人 |
Yamaguchi Wataru;Ina Hideki;Muraki Masato |
| 分类号 |
H01J37/304;H01L21/268;H01L21/66;H01J37/317 |
主分类号 |
H01J37/304 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An apparatus for irradiating a charged particle beam comprising:
an optical system configured to irradiate a substrate with the charged particle beam; a control unit configured to control an irradiation position of the charged particle beam; and a first measurement unit and a second measurement unit each configured to measure a surface position of the substrate, wherein the first measurement unit and the second measurement unit have different characteristics in terms of charging, and wherein the control unit controls the irradiation position of the charged particle beam on the substrate based on values measured by the first measurement unit and the second measurement unit. |
| 地址 |
Tokyo JP |
