COMPOSITION AND METHODS OF FORMING SOLDER BUMP AND FLIP CHIP USING THE SAME

摘要

Provided are a composition for an anisotropic conductive adhesive, a method of forming a solder bump and a method of forming a flip chip using the same. The composition for an anisotropic conductive adhesive includes a low melting point solder particle and a thermo-curable polymer resin. The anisotropic conductive adhesive includes forming a mixture by mixing a polymer resin and a curing agent, and mixing a deforming agent, a catalyst or a reductant with the mixture.

主权项

1. A method of forming a flip chip, comprising:
providing a first composition between a first substrate having first conductive patterns and a second substrate having second conductive patterns, the first composition comprising a low melting point solder, a thermal-curable polymer resin, and a curing agent of an anhydride family material; and forming a contact portion connecting the first and second conductive patterns, the contact portion being made of the low melting point solder.