| 主权项 |
1. A manufacturing method of a package structure, comprising:
providing a substrate, the substrate having an upper surface, a lower surface, and an opening, the upper surface and the lower surface being opposite to each other, the opening communicating the upper surface and the lower surface; configuring an electronic device in the opening of the substrate; laminating an adhesive layer and a patterned metal layer located on the adhesive layer on the lower surface of the substrate, the adhesive layer and the patterned metal layer exposing a bottom surface of the electronic device; forming a heat-dissipating column on the bottom surface of the electronic device exposed by the adhesive layer and the patterned metal layer, the heat-dissipating column connecting the patterned metal layer and the bottom surface of the electronic device; and respectively laminating a first laminated structure and a second laminated structure on the upper surface of the substrate and the patterned metal layer, the first laminated structure covering the upper surface of the substrate and a top surface of the electronic device, the second laminated structure covering the heat-dissipating column and the patterned metal layer. |
