SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE AND ELECTRONIC SYSTEM

摘要

Provided are a semiconductor device, a semiconductor package, and an electronic system. The semiconductor device comprises a substrate having a top surface and a bottom surface opposite to the top surface. An internal circuit is placed on or near the top surface of the substrate. Penetrating electrodes for signal input/output are placed in the substrate. Bottom surface conductive patterns which are electrically connected to the penetrating electrodes for signal input/output are placed on the bottom surface of the substrate. A bottom surface conductive structure which is separated from the penetrating electrodes for signal input/output is placed on the bottom surface of the substrate. The bottom surface conductive structure includes parallel supporter parts.