| 摘要 |
PROBLEM TO BE SOLVED: To obtain a semiconductor package which efficiently dissipates heat generated from an accommodated semiconductor device or the like while maintaining satisfactory airtightness.SOLUTION: Portions in four corners of a frame body 12 surrounding the vicinity of a heating area (semiconductor device 16) are thickened towards the inside, and four through holes 15 are provided which penetrate these portions. These through holes 15 are mounted from a top face of a package while using a screw 17 inserted from the top face side of the package so as to press the entire frame body 12 against a heat dissipation body 18 while including a cap 14. Thus, the four corners around the heating area are pressed and adhered to the heat dissipation body 18 without mitigating a vertical axis force generated by the screw 17. While sufficiently securing a contact area between a bottom face of a semiconductor package 1 and the heat dissipation body 18, its thermal resistance is also sufficiently reduced, thereby securing a satisfactory heat dissipation route spreading the heating area and the periphery thereof. |
