| 摘要 |
PROBLEM TO BE SOLVED: To provide a double-sided polishing device and a polishing method capable of holding an upper surface plate attitude during processing completion, and capable of suppressing load actuated during next plate fitting to avoid quality degradation.SOLUTION: Provided is the double-sided polishing device in which at least three gripping devices 17 for gripping a wire rope 15 stretched to side directions of a suspension plate 11 in a horizontal direction are disposed in a circumferential direction of the suspension plate 11 with approximately equal intervals. The gripping devices 17 grip the wire rope 15, so that an attitude of an upper surface plate 16 is held. The polishing method using the double-sided polishing device is also provided. |
