| 摘要 |
<p>PROBLEM TO BE SOLVED: To detect internal condition of a semiconductor module where a semiconductor element and an electrode terminal are connected by pressure contact.SOLUTION: A semiconductor module 1 includes a switching element 2, an AC electrode terminal 3, a DC electrode terminal 4, an unbalanced load suppression member 5, and a strain gauge 6. The AC electrode terminal 3 is provided for an upper surface of the switching element 2 and the DC electrode terminal 4 is provided for a lower surface of the switching element 2 with the unbalanced load suppression member 5 in-between. A cooler 8 is provided for an upper surface of the AC electrode terminal 3 with an insulation plate 7 in-between, a cooler 10 is provided for a lower surface of the DC electrode terminal 4 with an insulation plate 7 in-between, and the coolers 8 and 10 are fastened together by bolts 11. A case 12 is provided for a side surface of the semiconductor module 1 between the coolers 8 and 10 and the strain gauge 6 is provided for an outside surface of the case 12. A compression stress in a pressure contact direction exerted on the case 12 is detected by the strain gauge 6.</p> |
