METHOD FOR FORMING AN ORGANIC DEVICE

摘要

The present invention provides a method for forming an organic device having a patterned conductive layer that includes providing a substrate, depositing organic materials over the substrate to form one or more organic layers, coating a photoresist solution over the one or more organic layers to form a photo-patternable layer, wherein the solution includes a fluorinated photoresist material and a first fluorinated solvent, selectively exposing portions of the photo-patternable layer to radiation to form a first pattern of exposed fluorinated photoresist material and a second pattern of unexposed fluorinated photoresist material, exposing the substrate to a second fluorinated solvent to develop the photo-patternable layer, removing the second pattern of unexposed fluorinated photoresist material without removing the first pattern of exposed fluorinated photoresist material, coating one or more conductive layers over the one or more organic layers and removing a portion of the one or more of the conductive layers to form a pattern. Particular embodiments of the present invention for forming arrays of top contact TFTs and a pixilated organic device are also provided.

主权项

1) A method for forming an organic device having a patterned conductive layer, including:
a. providing a substrate; b. depositing organic materials over the substrate to form one or more organic layers; c. coating a photoresist solution over the one or more organic layers to form a photo-patternable layer, wherein the solution includes a fluorinated photoresist material and a first fluorinated solvent; d. selectively exposing portions of the photo-patternable layer to radiation to form a first pattern of exposed fluorinated photoresist material and a second pattern of unexposed fluorinated photoresist material; e. exposing the substrate to a second fluorinated solvent to develop the photo-patternable layer, removing the second pattern of unexposed fluorinated photoresist material without removing the first pattern of exposed fluorinated photoresist material; f. coating one or more conductive layers over the one or more organic layers; and g. removing a portion of the one or more of the conductive layers to form a pattern.