APPARATUS AND METHOD FOR DISSIPATING HEAT

摘要

An apparatus includes a display. The display may include a frame disposed at a bottom surface of the display. The apparatus may include a semiconductor chip. A heat pipe constructed of a thermally conductive material may be affixed to the frame. A surface of the heat pipe may oppose the semiconductor chip at a predetermined distance from the semiconductor chip.

主权项

1. An apparatus comprising:
a display including a frame disposed at a bottom surface of the display; a semiconductor chip; and a first heat pipe affixed to the frame, the first heat pipe being comprised of a thermally conductive material, wherein a surface of the first heat pipe opposes the semiconductor chip at a predetermined distance from the semiconductor chip.