| 发明名称 |
MOTION SENSOR AND PACKAGING METHOD THEREOF |
| 摘要 |
A motion sensor includes: a substrate, which includes a plurality of lead frame layers and a plurality of ceramic layers; a light source, disposed on the substrate, for emitting light; a sensing device, disposed on the substrate, for receiving the light to perform motion sensing; a cover, for fixing and protecting the light source and the sensing device; and an adhesive, for gluing the cover to the substrate, the adhesive including a component capable of blocking the light; wherein the light is infrared light, visible light or ultraviolet light. |
| 申请公布号 |
US2014319328(A1) |
申请公布日期 |
2014.10.30 |
| 申请号 |
US201414264038 |
申请日期 |
2014.04.28 |
| 申请人 |
LITE-ON SEMICONDUCTOR CORPORATION |
发明人 |
Hsieh Ming-Hsun |
| 分类号 |
G01J1/42;H01L25/16;H01L25/00 |
主分类号 |
G01J1/42 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A motion sensor, comprising:
a substrate, comprising a plurality of lead frame layers and a plurality of ceramic layers; a light source, disposed on the substrate, for emitting light; a sensing device, disposed on the substrate, for receiving the light to perform motion sensing; a cover, for fixing and protecting the light source and the sensing device; and an adhesive, for gluing the cover to the substrate, the adhesive comprising a component capable of blocking the light; wherein the light is infrared light, visible light or ultraviolet light. |
| 地址 |
New Taipei City TW |
