发明名称 Multi-functional detachable and replaceable wire bonding heating plate
摘要 A multi-functional detachable and replaceable wire bonding heating plate is provided with a heat blocking layer, a heating layer, a heat equalization layer, and a top layer. The bottom of the heat blocking layer has a recessed portion and the heating layer is disposed on top of the heat blocking layer. The heat equalization layer is disposed on top of the heating layer. A detachable and replaceable top layer is disposed on top of the heat equalization layer wherein a protruding support block is disposed on top of the top layer. The heat equalization layer and the top layer can be securely bonded to each other by the attraction force method, the engaging method, and the vacuum method. The invention allows the top layer to be timely detached and properly replaced to meet the specifications of different lead frames or PCB substrates and can reduce the production cost.
申请公布号 US2014319199(A1) 申请公布日期 2014.10.30
申请号 US201414265382 申请日期 2014.04.30
申请人 Pram Technology Inc. 发明人 Liu Wen-Long
分类号 H01L23/00 主分类号 H01L23/00
代理机构 代理人
主权项 1. A multi-functional detachable and replaceable wire bonding heating plate comprising: a heat blocking layer; a heating layer; a heat equalization layer; and a top layer; wherein a bottom of the heat blocking layer is formed with a recessed portion; wherein the heating layer is disposed on top of the heat blocking layer; and wherein the heat equalization layer is disposed on top of the heating layer; further comprising: a detachable replaceable top layer disposed on top of the heat equalization layer; a protruding support block disposed on top of the top layer; and a first through hole interconnected the heat blocking layer, the heating layer, and the heat equalization layer; wherein the top layer includes a second through hole and a groove disposed in bottom of the top layer and connected the first through hole and the second through hole.
地址 Kaohsiung TW
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