| 发明名称 |
PRINTED CIRCUIT BOARD AND METHOD OF MOUNTING COMPONENTS ON THE PRINTED CIRCUIT BOARD |
| 摘要 |
A printed circuit board on which a component having a plurality of terminals is to be mounted by using a reflow soldering process, includes wiring patterns that are arranged in correspondence with the plurality of terminals and have a size which is smaller in wiring patterns for terminals near the central portion of the component than in wiring patterns for terminals near each end portion of the component. |
| 申请公布号 |
US2014318850(A1) |
申请公布日期 |
2014.10.30 |
| 申请号 |
US201314362390 |
申请日期 |
2013.02.13 |
| 申请人 |
CANON KABUSHIKI KAISHA |
发明人 |
Yokoyama Junnosuke |
| 分类号 |
H05K1/02;H05K3/34 |
主分类号 |
H05K1/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A printed circuit board on which a component having a plurality of terminals is to be mounted by using a reflow soldering process, comprising:
wiring patterns that are arranged in correspondence with the plurality of terminals of the component and have a size which is smaller in wiring patterns for terminals near a central portion of the component than in wiring patterns for terminals near each end portion of the component. |
| 地址 |
Tokyo JP |
