WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

摘要

A wiring board of the present invention includes a core substrate in which wiring conductors are formed on both surfaces of an insulating plate, and a build-up layer in which a conductor layer is formed on a surface of an insulating resin layer having a higher coefficient of thermal expansion than that of the insulating plate. At least one build-up layer is stacked on one surface or both surfaces of the core substrate. Both surfaces of the insulating plate have different coefficients of thermal expansion. At least one build-up layer is stacked on a surface having a lower coefficient of thermal expansion. No build-up layer is stacked on the opposite surface, or a smaller number of build-up layers than that of the build-up layer formed on the surface having the lower coefficient of thermal expansion is formed on the opposite surface.

主权项

1. A wiring board comprising:
a core substrate configured such that both surfaces of an insulating plate are provided with a wiring conductor; and a build-up layer configured such that a conductor layer is formed on a surface of an insulating resin layer having a higher coefficient of thermal expansion than that of the insulating plate, the build-up layer being arranged such that at least one build-up layer is stacked on one surface or both surfaces of the core substrate, wherein both surfaces of the insulating plate have different coefficients of thermal expansion, one of the surfaces having a lower coefficient of thermal expansion is provided with at least one build-up layer stacked thereon, and the opposite surface is provided with no build-up layer or a smaller number of build-up layers stacked thereon than the number of the build-up layer stacked on the surface having the lower coefficient of thermal expansion.