| 发明名称 |
METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD |
| 摘要 |
Embodiments of the invention provide a method of manufacturing a printed circuit board. The method includes the steps of mounting a strip substrate on a fixing member, and separating the strip substrate into unit substrates by performing a singulation process. The method further includes the steps of attaching solder balls onto the unit substrates using a mask disposed on the unit substrates, and fixing the solder balls on the unit substrates by performing a reflow process. |
| 申请公布号 |
US2014317919(A1) |
申请公布日期 |
2014.10.30 |
| 申请号 |
US201414323728 |
申请日期 |
2014.07.03 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
KIM Jin Su;CHOI Seog Moon |
| 分类号 |
H05K3/34 |
主分类号 |
H05K3/34 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of manufacturing a printed circuit board, comprising:
mounting a strip substrate on a fixing member; separating the strip substrate into unit substrates by performing a singulation process; attaching solder balls onto the unit substrates using a mask disposed on the unit substrates; and fixing the solder balls on the unit substrates by performing a reflow process. |
| 地址 |
Gyeonggi-Do KR |
