SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device and a manufacturing method of the same which can achieve downsizing.SOLUTION: A semiconductor device manufacturing method comprises: forming an element isolation region 14 on a semiconductor substrate 10; forming a first conductivity type first well 16a and second well 16b by introducing a first conductivity type first impurity; forming a second conductivity type third well 20a by introducing a second conductivity type second impurity and forming a second conductivity type isolation well 32 by introducing the second impurity into a region between the first well and the second well; and further introducing a second conductivity type third impurity into the region between the first well and the second well.