| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a new stable, condensable chemical mechanical polishing composition for final polishing of silicon wafers.SOLUTION: The stable, condensable chemical mechanical polishing composition for polishing silicon wafers is provided, containing: water; an abrasive; a cation represented by the formula (I); piperazine or a piperazine derivative represented by the formula (II); and, optionally, a pH adjusting agent. The polishing composition exhibits a silicon removal rate of at least 300 nm/min. Also provided are methods of making and using the stable, condensable chemical mechanical polishing composition.</p> |
