| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method for producing a conductive material, in which conductive layers are laminated in a sufficient adhesion strength on an insulator substrate, to retain a coating homogeneity over a specific resin layer by forming the resin layer over a substrate without using copper foil joining with an adhesive agent and without using a vacuum facility, by a more convenient and highly reliable method without any need for converting a layer containing metallic fine particles formed by an application into a heterogeneous conductive film.SOLUTION: A conductive material manufacturing method comprises: a step of forming a resin layer 2 over an insulating substrate 1 by applying a resin layer forming composite; a step of forming a nonconductive layer 3' by applying a dispersion liquid containing 0.5 mass % or more of metallic fine particles protected by a chemical compound having N, S, P or O on the resin layer, to form a nonconductive layer 3'; and a step of electroless-plating a base material having the nonconductive layer, to form a conductive layer 4. The resin layer forming composite manufactures a conductive material such as a resin layer forming composite containing a vinyl resin and an aqueous medium.</p> |
