METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

A wafer chuck holds a wafer on a surface thereof such that an image of the wafer can be formed from light reflected by the surface of the wafer chuck. The surface of the wafer chuck is a planar surface that has a reflectivity equal to or greater than 40%, and/or a whiteness index value equal to or greater than 90. The wafer chuck can include a ceramic containing aluminum oxide having a purity equal to or greater than 95%. The planar surface of the wafer chuck is such that light illuminating the surface of the wafer chuck is reflected by the surface of the wafer chuck through the wafer. The wafer chuck can be used with an apparatus for cutting the wafer, and the light reflected by the surface can be used to form an image of the wafer used identifying cutting lines on the wafer.

主权项

1. An apparatus for cutting a wafer comprising:
a wafer chuck configured to hold the wafer on a surface thereof, wherein the surface of the wafer chuck on which the wafer is held has a reflectivity equal to or greater than 40%; a light source configured to illuminate the surface of the wafer chuck; an image capture device configured to form an image of the wafer based on light emitted by the light source and reflected by the surface of the wafer chuck; a processor configured to determine locations of cutting lines on the wafer based on the formed image; and a cutting assembly configured to cut the wafer along the cutting lines determined by the processor.