发明名称 SEMICONDUCTOR DIODE AND METHOD OF MANUFACTURE
摘要 A diode (200) is disclosed having improved efficiency, smaller form factor, and reduced reverse biased leakage current. Schottky diodes (212) are formed on the sidewalls (210) of a mesa region (206). The mesa region (206) is a cathode of the Schottky diode (212). The current path through the mesa region (206) has a lateral and a vertical current path. The diode (200) further comprises a MOS structure (214), p-type regions (220), MOS structures (230), and p-type regions (232). MOS structure (214) with the p-type regions (220) pinch-off the lateral current path under reverse bias conditions. P-type regions (220), MOS structures (230), and p-type regions (232) each pinch-off the vertical current path under reverse bias conditions. MOS structure (214) and MOS structures (230) reduce resistance of the lateral and vertical current path under forward bias conditions. The mesa region (206) can have a uniform or non-uniform doping concentration.
申请公布号 US2014319644(A1) 申请公布日期 2014.10.30
申请号 US201414331503 申请日期 2014.07.15
申请人 Semiconductor Components Industries, LLC 发明人 Grivna Gordon M.;Hall Jefferson W.;Quddus Mohammed Tanvir
分类号 H01L29/872;H01L27/06 主分类号 H01L29/872
代理机构 代理人
主权项
地址 Phoenix AZ US