发明名称 RESIN COMPOSITION AND FILM USING THE SAME
摘要 <p>PROBLEM TO BE SOLVED: To provide a resin composition yielding, even when used sparingly, a desired reverse wavelength dispersion property, exhibiting, when molded as a film, a low photoelastic coefficient, and endowed simultaneously with heat resistance and melt workability.SOLUTION: The provided resin composition consists of or includes a polymer including a divalent aromatic group repeating unit expressed by the following general formula (1) and a divalent non-aromatic group repeating unit expressed by the following general formula (2) in a state where the inclusion ratio of the divalent non-aromatic group repeating unit expressed by the general formula (2) with respect to all repeating units included within the entire resin composition is at least 50 mol%.</p>
申请公布号 JP2014205829(A) 申请公布日期 2014.10.30
申请号 JP20140058791 申请日期 2014.03.20
申请人 MITSUBISHI CHEMICALS CORP 发明人 HAYASHI HIROYUKI;UEHARA HISATOSHI;SUMIYA NAOKO;KUSAKA HARUHIKO;NAMIKI SHINGO;HIRAMI YUICHI
分类号 C08L101/06;C08G64/00;C08J5/18;C08L69/00;G02B5/30 主分类号 C08L101/06
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