Systems and Methods for Stacked Semiconductor Memory Devices

摘要

Systems and methods are provided for stacked semiconductor memory devices. The stacked semiconductor memory devices can include a nonvolatile memory controller, a number of nonvolatile memory dies arranged in a stacked configuration, and a package substrate. The memory controller and the memory dies can be coupled to each other with vias that extend through the package substrate. A vertical interconnect process may be used to electrically connect the nonvolatile memory dies to each other, as well as other system components. The memory controller may be flip-chip bonded to external circuitry, such as another semiconductor device or a printed circuit board.

主权项

1. A semiconductor package, comprising:
a package substrate; a first integrated circuit die having an active side and a back side, wherein the first integrated circuit die is embedded in the package substrate; and a second integrated circuit die formed on the package substrate, wherein the back side of the first integrated circuit die faces the second integrated circuit die.