SEMICONDUCTOR DEVICE

摘要

In a semiconductor device in which a semiconductor chip is cooled by a cooler, an insulating member between a semiconductor chip and a cooler is omitted in order to simplify the configuration. A cooler (23, 24, 25) for performing heat exchange between a semiconductor chip (21, 22) and a refrigerant is provided. The refrigerant is non-conductive. The semiconductor chip (21, 22) and the cooler (23, 24, 25) are connected to each other through a conductive connection component (28) or are directly connected to each other.

主权项

1. A semiconductor device comprising:
a semiconductor chip (21, 22); and a cooler (23, 24, 25) that performs heat exchange between the semiconductor chip (21, 22) and refrigerant, wherein the refrigerant is non-conductive, and the semiconductor chip (21, 22) and the cooler (23, 24, 25) are either connected to each other via a conductive connection component (28) or directly connected to each other.