发明名称 |
Cu-Diamond Based Solid Phase Sintered Body Having Excellent Heat Resistance, Heat Sink Using The Same, Electronic Device Using The Heat Sink, And Method For Producing Cu-Diamond Based Solid Phase Sintered Body Having Excellent Heat Resistance |
摘要 |
An inexpensive Cu-diamond based composite material having excellent heat conductivity and heat resistance. Conventionally, an infiltration method does not provide a Cu-diamond based composite material having high heat conductivity; an ultrahigh pressure method is expensive; and electric current pressure sintering provides relatively high heat conductivity, a low cost, but insufficient heat resistance. A Cu-diamond based solid phase sintered body contains 2 vol % or more and 6 vol % or less of Cr, and 30 vol % or more and 80 vol % or less of diamond particles containing 20 vol % or more of a high crystallinity diamond component. |
申请公布号 |
US2014321060(A1) |
申请公布日期 |
2014.10.30 |
申请号 |
US201414249337 |
申请日期 |
2014.04.09 |
申请人 |
FUJI DIE CO., LTD. |
发明人 |
Ishii Masayuki;Suzuki Saki;Kitamura Kozo;Tsuchiya Kazuhiko;Saito Minoru;Terada Osamu;Hayashi Koji |
分类号 |
C09K5/14;B22F3/14;H05K7/20 |
主分类号 |
C09K5/14 |
代理机构 |
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代理人 |
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主权项 |
1. A Cu-diamond based solid phase sintered body comprising: 30 vol % or more and 80 vol % or less of a diamond component; and 2 vol % or more and 6 vol % or less of Cr; with the balance of the sintered body being Cu and any impurities. |
地址 |
Tokyo JP |