发明名称 Cu-Diamond Based Solid Phase Sintered Body Having Excellent Heat Resistance, Heat Sink Using The Same, Electronic Device Using The Heat Sink, And Method For Producing Cu-Diamond Based Solid Phase Sintered Body Having Excellent Heat Resistance
摘要 An inexpensive Cu-diamond based composite material having excellent heat conductivity and heat resistance. Conventionally, an infiltration method does not provide a Cu-diamond based composite material having high heat conductivity; an ultrahigh pressure method is expensive; and electric current pressure sintering provides relatively high heat conductivity, a low cost, but insufficient heat resistance. A Cu-diamond based solid phase sintered body contains 2 vol % or more and 6 vol % or less of Cr, and 30 vol % or more and 80 vol % or less of diamond particles containing 20 vol % or more of a high crystallinity diamond component.
申请公布号 US2014321060(A1) 申请公布日期 2014.10.30
申请号 US201414249337 申请日期 2014.04.09
申请人 FUJI DIE CO., LTD. 发明人 Ishii Masayuki;Suzuki Saki;Kitamura Kozo;Tsuchiya Kazuhiko;Saito Minoru;Terada Osamu;Hayashi Koji
分类号 C09K5/14;B22F3/14;H05K7/20 主分类号 C09K5/14
代理机构 代理人
主权项 1. A Cu-diamond based solid phase sintered body comprising: 30 vol % or more and 80 vol % or less of a diamond component; and 2 vol % or more and 6 vol % or less of Cr; with the balance of the sintered body being Cu and any impurities.
地址 Tokyo JP