| 发明名称 |
ENCAPSULATION FILM |
| 摘要 |
Provided are an encapsulating film, an electronic device and a method of manufacturing the same. An encapsulating film having excellent moisture blocking property, handleability, workability and durability and a structure including a diode encapsulated with the encapsulating film may be provided. |
| 申请公布号 |
US2014319999(A1) |
申请公布日期 |
2014.10.30 |
| 申请号 |
US201414323703 |
申请日期 |
2014.07.03 |
| 申请人 |
LG CHEM, LTD. |
发明人 |
CHO Yoon Gyung;YOO Hyun Jee;CHANG Suk Ky;SHIM Jung Sup;LEE Seung Min |
| 分类号 |
B32B27/08;H01L51/52;H01L51/56;B32B27/18 |
主分类号 |
B32B27/08 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An encapsulating film, comprising:
a first layer that includes component having a contact angle of deionized water of 80 degrees or more and a water vapor transmission rate of 50 g/m2·day or less; and a second layer including a curable resin composition, wherein the water vapor transmission rate is measured in a thickness direction at 100° F. and a relative humidity of 100% by forming a film having a thickness of 100 μm using the component. |
| 地址 |
Seoul KR |
