| 发明名称 |
EPOXY RESIN COMPOUND AND RADIANT HEAT CIRCUIT BOARD USING THE SAME |
| 摘要 |
An epoxy resin compound having an epoxy resin, a curing agent, and inorganic filler as main components is provided. The epoxy resin includes an epoxy resin of Chemical Formula. Accordingly, the thermal conductivity of the epoxy resin compound can be increased because the epoxy resin has a mesogen structure that facilitates crystallizability. In addition, a high radiant heat board can be provided by using the above-mentioned epoxy resin as an insulating material for a printed circuit board. |
| 申请公布号 |
US2014318835(A1) |
申请公布日期 |
2014.10.30 |
| 申请号 |
US201214241961 |
申请日期 |
2012.08.30 |
| 申请人 |
Kim Hae Yeon;Moon Sung Bae;Park Jae Man;Park Jeung Ook;Yoon Jong Heum;Cho In Hee |
发明人 |
Kim Hae Yeon;Moon Sung Bae;Park Jae Man;Park Jeung Ook;Yoon Jong Heum;Cho In Hee |
| 分类号 |
H05K1/05;C09K5/14 |
主分类号 |
H05K1/05 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An epoxy resin compound comprising an epoxy resin, a curing agent, and an inorganic filler,
wherein the epoxy resin comprises an epoxy resin of the following chemical formula: where n is an integer of 0 to 10. |
| 地址 |
Seoul KR |
