| 摘要 |
<p>A method for producing a printed circuit board (13, 15, 16) with multilayer subareas in sections, characterized by the following steps: a) providing at least one conducting foil (1, 1') and application of a dielectric insulating foil (3, 3') to at least one subarea of the conducting foil; b) applying a structure of conducting paths (4, 4') to the insulating layer (3, 3'); c) providing one further printed circuit board structure; d) joining of the further printed circuit board structure with the conducting foil (1, 1') plus insulating layer (3, 3') and conducting paths (4, 4') by interposing a prepreg layer (5, 85; 18, 18'), and e) laminating the parts joined in step d) under pressing pressure and heat; and a printed circuit board produced according to this method.</p> |
