| 摘要 |
<p>Disclosed are a polyimide film for flexible film flip chip encapsulation and a preparation method of the polyimide film. The preparation method of the polyimide comprises the following steps: mixing an aromatic tetracarboxylic acid dianhydride compound, an aromatic diamine compound, a dehydrating agent, and a catalyst, the molar weight of the aromatic diamine compound being less than or equal to that of the aromatic tetracarboxylic acid dianhydride compound, and the dehydrating agent using at least one of benzoic anhydride, acetic anhydride, propionic anhydride, and butyric anhydride; and sublimating the mixture of picoline, lutidine, and methyl ethyl pyridine, and then grinding it to obtain the catalyst.</p> |
